Design Verification · Failure Analysis
Identifying the failure mechanism of defective units from the field and the production line, and proposing the design changes that prevent recurrence.
From non-destructive analysis to destructive analysis and environmental reproduction — all in one place.
Key services
Tracing the root cause of failure
We trace the essential cause of a failure, clearly identifying mechanisms such as electrical overstress (EOS), electrostatic discharge (ESD) and dendrite growth from ion migration.
Design guidance to prevent recurrence
Based on the analysis data we propose design changes for the next model, and report design guidelines and process improvements that reduce field quality cost.
Subjects of analysis
- Field defective units
- In-process defects
- Reproduction of intermittent faults
- Degraded units
- Comparative sample analysis
- Test result analysis
Analysis stages and key items
- 01NDA
Non-destructive analysis
- X-ray inspection for internal pattern opens and shorts
- Optical microscopy of appearance and solder joint cracks
- 02Electrical Stress
Electrical stress reproduction
- EOS (electrical overstress) and ESD immunity testing
- Measuring internal I-V characteristic shifts with a curve tracer
- 03Destructive
Destructive analysis
- Micro-sectioning for delamination analysis
- Device decapsulation analysis
- 04Reproduction
Environmental reproduction testing
- Reproducing the temperature and humidity at the point of failure
- Identifying the failure mechanism through accelerated testing
Key analysis equipment
- SEM (scanning electron microscope)JEOL JSM-6010PLUS/LV
- SAM (scanning acoustic microscope)SONOSCAN D9600
- X-ray systemNIKON XTV 160
- Curve tracerAdvantest 370B
- Optical microscopeHISCOPE S26146
- Thermal camera and data loggerFLIR-T425 · YOKOGAWA 30ch